IP Library › Assignment 033032/0169
Patent Assignment
Reel/Frame 033032/0169

Security Interest

Recorded: 2014-05-27 Pages: 6
Assignor
MEMC KOREA COMPANY
Executed: 2014-05-27
Assignee
GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
200 WEST STREET, NEW YORK, NEW YORK, 10282-2198
Covered Property (1)
Polishing Slurry Composition and Method of Using the Same
Patent: 7,601,273 →
Application: 11/367,406 →
Publication: US 2006/0196850
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Corrective Assignment to Correct the Name of the Second Receiving Party Previously Recorded on Reel 017651 Frame 0878. Assignor(S) Hereby Confirms the Assignment Sep 24, 2014
From: ROH, HYUN SOO; PARK, TAE WON; LEE, TAE YOUNG; LEE, IN KYUNG
To: CHEIL INDUSTRIES, INC.; MEMC KOREA COMPANY
Reel/Frame 033812/0477 →
Release of Security Interest Dec 31, 2015
From: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
To: MEMC KOREA COMPANY
Reel/Frame 037392/0561 →