Patent Assignment
Reel/Frame 037392/0561
Release of Security Interest
Recorded: 2015-12-31
Pages: 5
Assignor
GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
Executed: 2015-12-29
Assignee
MEMC KOREA COMPANY
854, MANGHYANG-RO, SEONGGEO-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, 331-831, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Slurry Composition and Method of Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Security Interest
May 27, 2014
From: MEMC KOREA COMPANY
To: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
Reel/Frame 033032/0169 →
Corrective Assignment to Correct the Name of the Second Receiving Party Previously Recorded on Reel 017651 Frame 0878. Assignor(S) Hereby Confirms the Assignment
Sep 24, 2014
From: ROH, HYUN SOO; PARK, TAE WON; LEE, TAE YOUNG; LEE, IN KYUNG
To: CHEIL INDUSTRIES, INC.; MEMC KOREA COMPANY
Reel/Frame 033812/0477 →