Patent Assignment
Reel/Frame 033812/0477
Corrective Assignment to Correct the Name of the Second Receiving Party Previously Recorded on Reel 017651 Frame 0878. Assignor(S) Hereby Confirms the Assignment
Recorded: 2014-09-24
Pages: 6
Assignors
ROH, HYUN SOO
Executed: 2006-03-06
PARK, TAE WON
Executed: 2006-03-06
LEE, TAE YOUNG
Executed: 2006-03-06
LEE, IN KYUNG
Executed: 2006-03-06
LEE, CHIN HO
Executed: 2006-03-06
KIM, YOUNG WOO
Executed: 2006-03-06
CHOI, MOON RO
Executed: 2006-03-06
KIM, JONG SEOP
Executed: 2006-03-06
Assignees
CHEIL INDUSTRIES, INC.
290, GONGDAN 2-DONG, GUMI-SI, GYEONGSANGBUK-DO, KOREA, REPUBLIC OF
MEMC KOREA COMPANY
27 OHMOK-RI, SEONGGUH-EUP, CHUNAN-SI, CHOONGCHEONGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Slurry Composition and Method of Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Security Interest
May 27, 2014
From: MEMC KOREA COMPANY
To: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
Reel/Frame 033032/0169 →
Release of Security Interest
Dec 31, 2015
From: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
To: MEMC KOREA COMPANY
Reel/Frame 037392/0561 →