Patent Assignment
Reel/Frame 033323/0899
Assignment of Assignor's Interest
Recorded: 2014-07-16
Pages: 6
Assignors
HUANG, PING
Executed: 2014-07-11
ALLISON, WILLIAM C.
Executed: 2014-07-11
FRENTZEL, RICHARD
Executed: 2014-07-15
LEFEVRE, PAUL ANDRE
Executed: 2014-07-11
KERPRICH, ROBERT
Executed: 2014-07-11
SCOTT, DIANE
Executed: 2014-07-16
Assignee
NEXPLANAR CORPORATION
7175 NW EVERGREEN PARKWAY, SUITE 200, HILLSBORO, OREGON, 97124
Covered Property
(1)
Low Density Polishing Pad
Application:
13/955,398 →
Publication:
US 2015/0038066
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Intellectual Property Security Joinder Agreement
Dec 31, 2015
From: NEXPLANAR CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037407/0071 →
Assignment of Assignor's Interest
Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Release of Security Interest
Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →