Patent Assignment
Reel/Frame 037407/0071
Intellectual Property Security Joinder Agreement
Recorded: 2015-12-31
Pages: 33
Assignor
NEXPLANAR CORPORATION
Executed: 2015-12-31
Assignee
BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
135 S. LASALLE STREET, IL4-135-05-41, CHICAGO, ILLINOIS, 60603
Covered Properties
(61)
Soft Polishing Pad for Polishing a Semiconductor Substrate
PCT:
PCT/US2011/020840 ↗
Cmp Pad with Local Area Transparency
PCT:
PCT/US2011/020870 ↗
Polishing Pad for Eddy Current End-Point Detection
PCT:
PCT/US2011/053678 ↗
Polishing Pad with Multi-Modal Distribution of Pore Diameters
PCT:
PCT/US2011/055796 ↗
Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern
PCT:
PCT/US2012/021899 ↗
Polishing Pad with Alignment Feature
PCT:
PCT/US2012/034717 ↗
Polishing Pad with Foundation Layer and Polishing Surface Layer
PCT:
PCT/US2012/038211 ↗
Polishing Pad with Homogeneous Body Having Discrete Protrusions Thereon
PCT:
PCT/US2012/038212 ↗
Polishing Pad with Aperture
PCT:
PCT/US2012/046037 ↗
Polishing Pad with Polishing Surface Layer Having an Aperture or Opening Above a Transparent Foundation Layer
PCT:
PCT/US2013/043126 ↗
Polishing Pad Having Polishing Surface with Continuous Protrusions
PCT:
PCT/US2014/011792 ↗
Polishing Pad Having Polishing Surface with Continuous Protrusions Having Tapered Sidewalls
PCT:
PCT/US2014/020754 ↗
Low Density Polishing Pad
PCT:
PCT/US2014/047065 ↗
Coated Compressive Subpad for Chemical Mechanical Polishing
PCT:
PCT/US2015/060343 ↗
Customized Polish Pads for Chemical Mechanical Planarization
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Customized Polishing Pads for Cmp and Methods of Fabrication and Use Thereof
Detachable Clearance Wands
Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
Customized Polish Pads for Chemical Mechanical Planarization
Customized polishing pads for CMP and methods of fabrication and use thereof
Grooved CMP pad
Polishing Systems
CMP pad with local area transparency
Customized Polish Pads for Chemical Mechanical Planarization
Soft Polishing Pad for Polishing a Semiconductor Substrate
Polishing Pad for Eddy Current End-Point Detection
Homogeneous Polishing Pad for Eddy Current End-Point Detection
Method of Fabricating a Polishing Pad with an End-Point Detection Region for Eddy Current End-Point Detection
Polishing Pad with Multi-Modal Distribution of Pore Diameters
Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern
Polishing Pad with Alignment Feature
Polishing Pad with Homogeneous Body Having Discrete Protrusions Thereon
Application:
13/113,655 →
Publication:
US 2012/0302148
Polishing Pad with Alignment Aperture
Polishing Pad with Foundation Layer and Polishing Surface Layer
Polishing Pad with Grooved Foundation Layer and Polishing Surface Layer
Polishing Pad with Polishing Surface Layer Having an Aperture or Opening Above a Transparent Foundation Layer
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Polishing Pad Having Polishing Surface with Continuous Protrusions
Polishing Systems
Polishing Pad Having Polishing Surface with Continuous Protrusions Having Tapered Sidewalls
Low Density Polishing Pad
Application:
13/955,398 →
Publication:
US 2015/0038066
Polishing Pad for Eddy Current End-Point Detection
Homogeneous Polishing Pad for Eddy Current End-Point Detection
Polishing Pad with Multi-Modal Distribution of Pore Diameters
Polishing Pad Having Porogens with Liquid Filler
Customized Polishing Pads for Cmp and Methods of Fabrication and Use Thereof
Polishing Pad with Homogeneous Body Having Discrete Protrusions Thereon
Method of Fabricating a Polishing
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Application:
14/562,589 →
Publication:
US 2015/0093977
Polishing Pad with Alignment Feature
Low Density Polishing Pad
Coated Compressive Subpad for Chemical Mechanical Polishing
Application:
14/635,973 →
Publication:
US 2016/0144477
Polishing Pad with Grooved Foundation Layer and Polishing Surface Layer
Polishing Pad with Foundation Layer and Polishing Surface Layer
Polishing Pad with Foundation Layer and Polishing Surface Layer
Application:
14/736,568 →
Publication:
US 2015/0273656
Soft Polishing Pad for Polishing a Semiconductor Substrate
Application:
14/823,956 →
Publication:
US 2015/0343595
Grooved Cmp Pads
Polishing Pad with Concentric or Approximately Concentric Polygon Groove Pattern
Application:
14/875,513 →
Publication:
US 2016/0023322
Polishing Pad with Foundation Layer and Window Attached Thereto
Double Coated Compressive Foam Subpad
Application:
62/083,101 →
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 12, 2010
From: ALLISON, WILLIAM; HUANG, PING; SCOTT, DIANE; FRENTZEL, RICHARD
To: NEXPLANAR CORPORATION
Reel/Frame 024096/0589 →
Assignment of Assignor's Interest
Aug 18, 2010
From: ALLISON, WILLIAM; SCOTT, DIANE; KERPRICH, ROBERT; HUANG, PING
To: NEXPLANAR CORPORATION
Reel/Frame 024856/0279 →
Assignment of Assignor's Interest
Aug 25, 2015
From: HUANG, PING; ALLISON, WILLIAM C.; FRENTZEL, RICHARD; LEFEVRE, PAUL ANDRE
To: NEXPLANAR CORPORATION
Reel/Frame 036414/0665 →
Assignment of Assignor's Interest
Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Release of Security Interest
Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name
Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Change of Name
Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name
Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →