IP Library Granted Patent US 9,249,273
Granted Patent B2
US 9,249,273 · App. 14/610,991 · Granted Feb 2, 2016

Polishing pad with alignment feature

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Quick Facts
Patent No.
US 9,249,273
App. No.
14/610,991
Granted
Feb 2, 2016
Kind
B2
Abstract

Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.

Claims (23)

1. A method of fabricating a polishing pad for polishing a substrate, the method comprising:

mixing a pre-polymer and a curative to form a mixture in the base of a formation mold;

moving the lid of the formation mold into the mixture, the lid having disposed thereon a pattern of protrusions and an alignment forming feature; and, with the lid placed in the mixture,

at least partially curing the mixture to form a molded homogeneous polishing body comprising a polishing surface having a pattern of grooves comprising a polishing region with an alignment feature disposed therein, corresponding to the pattern of protrusions and the alignment forming feature of the lid, wherein the alignment feature creates a singular asymmetry within the pattern of grooves.

2. The method of claim 1 , wherein the alignment forming feature is an alignment protrusion having a height of approximately 80% or greater of the height of the protrusions of the pattern of protrusions.

3. The method of claim 2 , wherein the alignment protrusion has a height at least the height of the protrusions of the pattern of protrusions.

4. The method of claim 1 , wherein forming the molded homogeneous polishing body comprises forming a thermoset polyurethane material.

5. The method of claim 1 , wherein the mixing further comprises adding a plurality of porogens to the pre-polymer and the curative to form a plurality of closed cell pores in the molded homogeneous polishing body, each closed cell pore having a physical shell.

6. The method of claim 1 , wherein the mixing further comprises injecting a gas into the pre-polymer and the curative, or into a product formed there from, to form a plurality of closed cell pores in the molded homogeneous polishing body, each closed cell pore having no physical shell.

7. The method of claim 1 , wherein mixing the pre-polymer and the curative comprises mixing an isocyanate and an aromatic diamine compound, respectively.

8. The method of claim 1 , wherein the mixing further comprises adding an opacifying lubricant to the pre-polymer and the curative to form an opaque molded homogeneous polishing body.

9. The method of claim 1 , wherein curing the mixture comprises first partially curing in the formation mold and then further curing in an oven.

10. A method of fabricating a polishing pad for polishing a substrate, the method comprising:

mixing a pre-polymer and a curative to form a mixture in the base of a formation mold;

moving the lid of the formation mold into the mixture, the lid having disposed thereon a pattern of protrusions and an alignment forming feature, wherein the alignment forming feature is an alignment protrusion having a height of approximately 80% or greater of the height of the protrusions of the pattern of protrusions; and, with the lid placed in the mixture,

at least partially curing the mixture to form a molded homogeneous polishing body comprising a polishing surface having a pattern of grooves comprising a polishing region with an alignment feature disposed therein, corresponding to the pattern of protrusions and the alignment forming feature of the lid.

11. The method of claim 10 , wherein the alignment protrusion has a height at least the height of the protrusions of the pattern of protrusions.

12. The method of claim 10 , wherein forming the molded homogeneous polishing body comprises forming a thermoset polyurethane material.

13. The method of claim 10 , wherein the mixing further comprises adding a plurality of porogens to the pre-polymer and the curative to form a plurality of closed cell pores in the molded homogeneous polishing body, each closed cell pore having a physical shell.

14. The method of claim 10 , wherein the mixing further comprises injecting a gas into the pre-polymer and the curative, or into a product formed there from, to form a plurality of closed cell pores in the molded homogeneous polishing body, each closed cell pore having no physical shell.

15. The method of claim 10 , wherein mixing the pre-polymer and the curative comprises mixing an isocyanate and an aromatic diamine compound, respectively.

16. The method of claim 10 , wherein the mixing further comprises adding an opacifying lubricant to the pre-polymer and the curative to form an opaque molded homogeneous polishing body.

17. The method of claim 10 , wherein curing the mixture comprises first partially curing in the formation mold and then further curing in an oven.

Assignments (10)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
INTELLECTUAL PROPERTY SECURITY JOINDER AGREEMENT Recorded Dec 31, 2015
From: NEXPLANAR CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037407/0071 →