Polishing pad with alignment aperture
View Patent ↗Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
1. A polishing apparatus for polishing a substrate, the polishing apparatus comprising:
a polishing pad having a polishing surface and a back surface, the polishing surface comprising a pattern of grooves;
an aperture disposed in the polishing pad from the back surface through to the polishing surface, wherein a first groove of the pattern of grooves is a circumferential groove continuous with the aperture at a first sidewall of the aperture but discontinuous with a second sidewall of the aperture, and wherein a second groove of the pattern of grooves is continuous with the aperture at the second sidewall; and
an adhesive sheet disposed on the back surface of the polishing pad but not in the aperture, the adhesive sheet providing an impermeable seal for the aperture at the back surface of the polishing pad.
2. The polishing apparatus of claim 1 , wherein the adhesive sheet comprises a layer of acrylic glue disposed on the back surface of the polishing pad and a layer of polyethylene terephthalate (PET) disposed on the layer of acrylic glue.
3. The polishing apparatus of claim 2 , wherein the adhesive sheet further comprises a layer of rubber glue disposed on the layer of PET, opposite the layer of acrylic glue.
4. The polishing pad of claim 3 , wherein the layer of rubber glue is for adhering the polishing pad to a platen of a chemical mechanical polishing tool.
5. The polishing apparatus of claim 1 , wherein the second sidewall is opposite the first sidewall, and the second groove is a circumferential groove discontinuous with the aperture at the first sidewall.
6. The polishing apparatus of claim 5 , wherein the pattern of grooves comprises at least one of a diversion groove parallel to the first sidewall of the aperture or a diversion groove parallel to the second sidewall of the aperture.
7. The polishing apparatus of claim 6 , wherein the pattern of grooves comprises a diversion groove parallel to the first sidewall of the aperture and a diversion groove parallel to the second sidewall of the aperture.
8. The polishing apparatus of claim 1 , wherein the second sidewall is orthogonal to the first sidewall, and the second groove is a radial groove.
9. The polishing apparatus of claim 1 , wherein the first groove has a ramp feature sloped toward the aperture at the first sidewall, and the second groove has a ramp feature sloped toward the aperture at the second sidewall.
10. The polishing apparatus of claim 1 , wherein the aperture comprises one or more rounded corners.
11. A polishing pad for polishing a substrate, the polishing pad comprising:
a polishing body having a polishing surface and a back surface, the polishing surface comprising a pattern of grooves; and
an aperture disposed in the polishing body from the back surface through to the polishing surface, wherein a first groove of the pattern of grooves is a circumferential groove continuous with the aperture at a first sidewall of the aperture but discontinuous with a second sidewall of the aperture, and wherein a second groove of the pattern of grooves is continuous with the aperture at the second sidewall.
12. The polishing pad of claim 11 , wherein the second sidewall is opposite the first sidewall, and the second groove is a circumferential groove discontinuous with the aperture at the first sidewall.
13. The polishing pad of claim 12 , wherein the pattern of grooves comprises at least one of a diversion groove parallel to the first sidewall of the aperture or a diversion groove parallel to the second sidewall of the aperture.
14. The polishing pad of claim 13 , wherein the pattern of grooves comprises a diversion groove parallel to the first sidewall of the aperture and a diversion groove parallel to the second sidewall of the aperture.
15. The polishing pad of claim 11 , wherein the second sidewall is orthogonal to the first sidewall, and the second groove is a radial groove.
16. The polishing pad of claim 11 , wherein the first groove has a ramp feature sloped toward the aperture at the first sidewall, and the second groove has a ramp feature sloped toward the aperture at the second sidewall.
17. The polishing pad of claim 11 , wherein the aperture comprises one or more rounded corners.