Polishing pad with multi-modal distribution of pore diameters
View Patent ↗Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
1. A method of fabricating a polishing pad for polishing a semiconductor substrate, the method comprising:
mixing a pre-polymer and a curative to form a mixture in a formation mold; and
curing the mixture to provide a molded homogeneous polishing body comprising a thermoset polyurethane material and a plurality of closed cell pores disposed in the thermoset polyurethane material, the plurality of closed cell pores having a multi-modal distribution of diameters, wherein the molded homogeneous polishing body further comprises a first, grooved surface and a second, flat surface opposite the first surface, and wherein curing the mixture comprises grading the multi-modal distribution of diameters throughout the thermoset polyurethane material with a gradient from the first, grooved surface to the second, flat surface, wherein the mixing further comprises adding a plurality of porogens to the pre-polymer and the curative to provide a first portion of the closed cell pores, each having a physical shell, and wherein the mixing further comprises injecting a gas into the pre-polymer and the curative, or into a product formed there from, to provide a second portion of the closed cell pores, each having no physical shell.
2. The method of claim 1 , wherein the pre-polymer is an isocyanate.
3. The method of claim 1 , wherein the multi-modal distribution of diameters is a bimodal distribution of diameters comprising a small diameter mode proximate to the first, grooved surface, and comprising a large diameter mode proximate to the second, flat surface.
4. The method of claim 1 , wherein mixing the pre-polymer and the curative comprises mixing an isocyanate and an aromatic diamine compound, respectively.
5. The method of claim 1 , wherein the mixing further comprises adding an opacifying lubricant to the pre-polymer and the curative to provide an opaque molded homogeneous polishing body.
6. The method of claim 1 , wherein curing the mixture comprises first partially curing in the formation mold and then further curing in an oven.
7. A method of fabricating a polishing pad for polishing a semiconductor substrate, the method comprising:
mixing a pre-polymer and a curative to form a mixture in a formation mold; and
curing the mixture to provide a molded homogeneous polishing body comprising a thermoset polyurethane material and a plurality of closed cell pores disposed in the thermoset polyurethane material, the plurality of closed cell pores having a multi-modal distribution of diameters, wherein the molded homogeneous polishing body further comprises a first, grooved surface and a second, flat surface opposite the first surface, and wherein curing the mixture comprises grading the multi-modal distribution of diameters throughout the thermoset polyurethane material with a gradient from the first, grooved surface to the second, flat surface, wherein the multi-modal distribution of diameters is a bimodal distribution of diameters comprising a small diameter mode proximate to the first, grooved surface, and comprising a large diameter mode proximate to the second, flat surface.
8. The method of claim 7 , wherein the mixing further comprises adding a plurality of porogens to the pre-polymer and the curative to provide the closed cell pores, each having a physical shell.
9. The method of claim 7 , wherein the mixing further comprises injecting a gas into the pre-polymer and the curative, or into a product formed there from, to provide the closed cell pores, each having no physical shell.
10. The method of claim 7 , wherein the pre-polymer is an isocyanate and the mixing further comprises adding water to the pre-polymer and the curative to provide the closed cell pores, each having no physical shell.
11. The method of claim 7 , wherein mixing the pre-polymer and the curative comprises mixing an isocyanate and an aromatic diamine compound, respectively.
12. The method of claim 7 , wherein the mixing further comprises adding an opacifying lubricant to the pre-polymer and the curative to provide an opaque molded homogeneous polishing body.
13. The method of claim 7 , wherein curing the mixture comprises first partially curing in the formation mold and then further curing in an oven.