Polishing pad with alignment feature
View Patent ↗Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
1. A polishing pad for polishing a substrate, the polishing pad comprising:
a polishing body having a polishing surface and a back surface, the polishing surface having a pattern of grooves comprising a polishing region, wherein the polishing region of the pattern of grooves comprises an alignment feature creating a singular asymmetry within the pattern of grooves, wherein the pattern of grooves comprises a plurality of circumferential grooves intersecting with a plurality of radial grooves, and wherein the alignment feature comprises an interruption in one of the circumferential grooves, the interruption disposed between two radial grooves.
2. The polishing pad of claim 1 , wherein the alignment feature has a length-wise dimension approximately in the range of ⅛ th of an inch to ¼ of an inch.
3. The polishing pad of claim 1 , wherein the alignment feature is adapted to remain throughout the polishing lifetime of the polishing pad.
4. The polishing pad of claim 1 , wherein the plurality of circumferential grooves is a plurality of concentric polygons.
5. The polishing pad of claim 1 , wherein the alignment feature indicates a location of a detection region disposed in the back surface of the polishing pad.
6. The polishing pad of claim 5 , wherein the alignment feature is positioned for alignment with a feature on a platen of a chemical mechanical polishing apparatus.
7. The polishing pad of claim 1 , wherein the polishing body is a molded polishing body, and wherein the alignment feature indicates a location of a region in a mold used for forming the molded polishing body.
8. The polishing pad of claim 1 , wherein the polishing body is a homogeneous polishing body comprising a thermoset polyurethane material.
9. The polishing pad of claim 1 , further comprising:
a local area transparency (LAT) region disposed in the polishing body.
10. A polishing pad for polishing a substrate, the polishing pad comprising:
a polishing body having a polishing surface and a back surface, the polishing surface having a pattern of grooves comprising a polishing region, wherein the pattern of grooves comprises a plurality of circumferential grooves intersecting with a plurality of radial grooves, and wherein the polishing region of the pattern of grooves comprises an alignment feature comprising an interruption in one of the circumferential grooves, the interruption disposed between two radial grooves.
11. The polishing pad of claim 10 , wherein the alignment feature has a length-wise dimension approximately in the range of ⅛ th of an inch to ¼ of an inch.
12. The polishing pad of claim 10 , wherein the alignment feature is adapted to remain throughout the polishing lifetime of the polishing pad.
13. The polishing pad of claim 10 , wherein the plurality of circumferential grooves is a plurality of concentric polygons.
14. The polishing pad of claim 10 , wherein the polishing body is a molded polishing body, and wherein the alignment feature indicates a location of a region in a mold used for forming the molded polishing body.
15. The polishing pad of claim 10 , wherein the polishing body is a homogeneous polishing body comprising a thermoset polyurethane material.
16. The polishing pad of claim 10 , further comprising:
a local area transparency (LAT) region disposed in the polishing body.