IP Library Granted Patent US 9,296,085
Granted Patent B2
US 9,296,085 · App. 14/530,534 · Granted Mar 29, 2016

Polishing pad with homogeneous body having discrete protrusions thereon

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Quick Facts
Patent No.
US 9,296,085
App. No.
14/530,534
Granted
Mar 29, 2016
Kind
B2
Abstract

Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.

Claims (21)

1. A polishing pad for polishing a substrate, the polishing pad comprising:

a homogeneous body having a polishing side and a back side, the homogeneous body comprising a material having a first hardness, and the polishing side comprising a plurality of protrusions having a pattern;

a plurality of discrete protrusions disposed on and aligned with the plurality of protrusions of the polishing side of the homogeneous body, the plurality of discrete protrusions comprising a material having a second hardness different from the first hardness, and the plurality of discrete protrusions having the pattern; and

a fill layer disposed on the homogeneous body, around the plurality of protrusions of the polishing side of the homogeneous body, the fill layer comprising the material of the plurality of discrete protrusions.

2. The polishing pad of claim 1 , wherein the fill layer is discontinuous with the plurality of discrete protrusions.

3. The polishing pad of claim 1 , wherein both the fill layer and the plurality of discrete protrusions are covalently bonded with the homogeneous body.

4. The polishing pad of claim 1 , wherein the homogeneous body is a molded homogeneous body, wherein the plurality of discrete protrusions is a plurality of molded protrusions, and wherein the fill layer is a molded fill layer.

5. The polishing pad of claim 1 , wherein the material of the homogeneous body comprises a first thermoset polyurethane material, and the material of the plurality of discrete protrusions and the fill layer comprises a second, different, thermoset polyurethane material.

6. The polishing pad of claim 1 , wherein the first hardness of the material of the homogeneous body is less than the second hardness of the material of the plurality of discrete protrusions and the fill layer.

7. The polishing pad of claim 6 , wherein the first hardness is less than approximately 40 Shore D, and the second hardness is greater than approximately 30 Shore D.

8. The polishing pad of claim 7 , wherein the first hardness is less than approximately 25 Shore D, and the second hardness is greater than approximately 40 Shore D.

9. The polishing pad of claim 1 , wherein the first hardness of the material of the homogeneous body is greater than the second hardness of the material of the plurality of discrete protrusions and the fill layer.

10. The polishing pad of claim 9 , wherein the second hardness is less than approximately 40 Shore D, and the first hardness is greater than approximately 30 Shore D.

11. The polishing pad of claim 10 , wherein the second hardness is less than approximately 25 Shore D, and the first hardness is greater than approximately 40 Shore D.

12. The polishing pad of claim 1 , wherein the homogeneous body is substantially circular, and one or more of the plurality of discrete protrusions is a partial circumferential protrusion or an arc-shaped protrusion.

13. The polishing pad of claim 1 , wherein the plurality of discrete protrusions comprises a plurality of tiles selected from the group consisting of circular tiles, oval tiles, square tiles, hexagonal tiles, and rectangular tiles.

14. The polishing pad of claim 1 , wherein each of the plurality of discrete protrusions has, in a global plane of the polishing side of the homogeneous body, a shortest dimension approximately in the range of 5-50 millimeters.

15. The polishing pad of claim 1 , further comprising:

a detection region disposed in the back side of the homogeneous body.

16. The polishing pad of claim 1 , further comprising:

a local area transparency (LAT) region disposed in the homogeneous body.

Assignments (12)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: HUANG, PING; KERPRICH, ROBERT; ALLISON, WILLIAM C.; FRENTZEL, RICHARD LEE; SCOTT, DIANE
To: NEXPLANAR CORPORATION
Reel/Frame 037704/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: BAJAJ, RAJEEV
To: NEXPLANAR CORPORATION
Reel/Frame 037703/0994 →
INTELLECTUAL PROPERTY SECURITY JOINDER AGREEMENT Recorded Dec 31, 2015
From: NEXPLANAR CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037407/0071 →