IP Library Granted Patent US 9,597,770
Granted Patent B2
US 9,597,770 · App. 14/550,129 · Granted Mar 21, 2017

Method of fabricating a polishing

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Quick Facts
Patent No.
US 9,597,770
App. No.
14/550,129
Granted
Mar 21, 2017
Kind
B2
Abstract

Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

Claims (16)

1. A method of fabricating a polishing pad for polishing a substrate, the method comprising:

mixing a set of polymerizable materials to form a mixture in a base of a formation mold;

moving a lid of the formation mold into the mixture, the lid having disposed thereon a pattern of protrusions and an aperture protrusion with a height greater than the pattern of protrusions; and, with the lid placed in the mixture,

at least partially curing the mixture to form a molded homogeneous polishing body comprising a back surface and a polishing surface having disposed therein a pattern of grooves and an opening defining an aperture region.

2. The method of claim 1 , wherein forming the molded homogeneous polishing body comprises forming an aperture disposed in the molded homogeneous polishing body from the back surface through to the polishing surface at the aperture region.

3. The method of claim 1 , further comprising:

removing a portion of the homogeneous polishing body from the back surface to form a polishing pad having a second back surface and to form an aperture disposed in the molded homogeneous polishing body from the second back surface through to the polishing surface at the aperture region.

4. The method of claim 1 , wherein forming the molded homogeneous polishing body comprises forming the aperture region to comprise a sidewall having a ramp feature with a slope to provide a narrowest region of the aperture region proximate to the back surface of the molded homogeneous polishing body and a widest region of the aperture region at the polishing surface of the molded homogeneous polishing body.

5. The method of claim 1 , wherein forming the molded homogeneous polishing body comprises forming the polishing surface to comprise a first groove of the pattern of grooves that is a circumferential groove continuous with the aperture region at a first sidewall of the aperture region but discontinuous with a second sidewall of the aperture region, and a second groove of the pattern of grooves that is continuous with the aperture region at the second sidewall.

6. The method of claim 1 , wherein forming the molded homogeneous polishing body comprises forming the polishing surface to comprise a first groove of the pattern of grooves that is a first radial groove continuous with the aperture region at a first sidewall of the aperture region, and a second groove of the plurality of grooves that is a second radial groove continuous with the aperture region at a second sidewall of the aperture region, wherein the first sidewall is opposite the second sidewall.

7. The method of claim 1 , wherein forming the molded homogeneous polishing body comprises forming a thermoset polyurethane material.

8. The method of claim 1 , wherein the mixing further comprises adding a porogen material to the set of polymerizable materials to form a plurality of closed cell pores in the molded homogeneous polishing body, each closed cell pore having a physical shell.

9. The method of claim 1 , wherein the mixing further comprises injecting a gas into the set of polymerizable materials, or into a product formed there from, to form a plurality of closed cell pores in the molded homogeneous polishing body, each closed cell pore having no physical shell.

10. The method of claim 1 , wherein mixing the set of polymerizable materials comprises mixing an isocyanate and an aromatic diamine compound.

11. The method of claim 1 , wherein the mixing further comprises adding an opacifying particle filler to the set of polymerizable materials to form an opaque molded homogeneous polishing body.

12. The method of claim 1 , wherein curing the mixture comprises first partially curing in the formation mold and then further curing in an oven.

Assignments (10)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
INTELLECTUAL PROPERTY SECURITY JOINDER AGREEMENT Recorded Dec 31, 2015
From: NEXPLANAR CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037407/0071 →