IP Library › Assignment 033617/0356
Patent Assignment
Reel/Frame 033617/0356

Assignment of Assignor's Interest

Recorded: 2014-08-27 Pages: 4
Assignors
IZUMI, KEISUKE
Executed: 2014-08-20
YANAGIDA, NAOHITO
Executed: 2014-08-20
SANO, MICHIAKI
Executed: 2014-08-20
YAMAZAKI, TAKEHIRO
Executed: 2014-08-20
IUCHI, HIROAKI
Executed: 2014-08-20
YANAI, AKIO
Executed: 2014-08-20
MIZUNO, GENTA
Executed: 2014-08-20
YAMAGUCHI, MINORU
Executed: 2014-08-20
Assignee
SANDISK TECHNOLOGIES INC.
TWO LEGACY TOWN CENTER, 6900 NORTH DALLAS PARKWAY, PLANO, TEXAS, 75024
Covered Property (1)
Multiheight Contact via Structures for a Multilevel Interconnect Structure
Patent: 9,401,309 →
Application: 14/468,744 →
Publication: US 2016/0064281
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0807 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →