Patent Assignment
Reel/Frame 034229/0722
Assignment of Assignor's Interest
Recorded: 2014-11-21
Pages: 14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Composition for Forming Topcoat Layer and Resist Pattern Formation Method Employing the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 21, 2014
From: OKAYASU, TETSUO; WANG, XIAOWEI; PAWLOWSKI, GEORG; HAMA, YUSUKE
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 034229/0765 →
Change of Address
Jan 12, 2017
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
Reel/Frame 041345/0585 →
Merger
Jul 27, 2020
From: RIDGEFIELD ACQUISITION
To: AZ ELECTRONIC MATERIALS S.À R.L.
Reel/Frame 053323/0591 →
Change of Legal Entity
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS S.À R.L.
To: AZ ELECTRONIC MATERIALS GMBH
Reel/Frame 053323/0760 →
Assignment of Assignor's Interest
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS GMBH
To: MERCK PATENT GMBH
Reel/Frame 053323/0770 →
Merger
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: RIDGEFIELD ACQUISITION
Reel/Frame 053324/0198 →