Patent Assignment
Reel/Frame 034229/0765
Assignment of Assignor's Interest
Recorded: 2014-11-21
Pages: 14
Assignors
OKAYASU, TETSUO
Executed: 2014-11-21
WANG, XIAOWEI
Executed: 2014-11-21
PAWLOWSKI, GEORG
Executed: 2014-11-21
HAMA, YUSUKE
Executed: 2014-11-21
Assignee
AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
32-36, BOULEVARD D? AVRANCHES, LUXEMBOURG, 1160, LUXEMBOURG
Covered Property
(1)
Composition for Forming Topcoat Layer and Resist Pattern Formation Method Employing the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 21, 2014
From: KIM, HYUN-WOO; PARK, CHEOL HONG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 034229/0722 →
Change of Address
Jan 12, 2017
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
Reel/Frame 041345/0585 →
Merger
Jul 27, 2020
From: RIDGEFIELD ACQUISITION
To: AZ ELECTRONIC MATERIALS S.À R.L.
Reel/Frame 053323/0591 →
Change of Legal Entity
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS S.À R.L.
To: AZ ELECTRONIC MATERIALS GMBH
Reel/Frame 053323/0760 →
Assignment of Assignor's Interest
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS GMBH
To: MERCK PATENT GMBH
Reel/Frame 053323/0770 →
Merger
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: RIDGEFIELD ACQUISITION
Reel/Frame 053324/0198 →