Patent Assignment
Reel/Frame 034663/0211
Assignment of Assignor's Interest
Recorded: 2015-01-08
Pages: 3
Assignors
IZUMI, KEISUKE
Executed: 2014-09-30
SANO, MICHIAKI
Executed: 2014-09-30
SASAKI, HIROSHI
Executed: 2014-10-01
Assignee
SANDISK TECHNOLOGIES INC.
TWO LEGACY TOWN CENTER, 6900 NORTH DALLAS PARKWAY, PLANO, TEXAS, 75024
Covered Property
(1)
Multiheight Electrically Conductive via Contacts for a Multilevel Interconnect Structure
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0807 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →