IP Library Assignment 034772/0058
Patent Assignment
Reel/Frame 034772/0058

Assignment of Assignor's Interest

Recorded: 2015-01-21 Pages: 2
Assignor
D'ABREU, MANUEL A.
Executed: 2015-01-19
Assignee
SANDISK TECHNOLOGIES INC.
TWO LEGACY TOWN CENTER, 6900 NORTH DALLAS PARKWAY, PLANO, TEXAS, 75024
Covered Property (1)
System, Method and Apparatus to Relieve Stresses in a Semiconductor Die Caused by Uneven Internal Metallization Layers
Patent: 9,659,882 →
Application: 14/600,316 →
Publication: US 2016/0211223
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0807 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →