IP Library Assignment 035867/0727
Patent Assignment
Reel/Frame 035867/0727

Assignment of Assignor's Interest

Recorded: 2015-06-19 Pages: 3
Assignor
MARUKO, TSUGUTO
Executed: 2015-05-13
Assignee
ROHM CO., LTD.
21, SAIIN MIZOSAKICHO, UKYO-KU, KYOTO, JAPAN
Covered Property (1)
Semiconductor Package, Printed Circuit Board Substrate and Semiconductor Device
Patent: 9,418,957 →
Application: 14/716,102 →
Publication: US 2015/0340335
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2020
From: ROHM CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 052273/0877 →
Assignment of Assignor's Interest Jun 17, 2020
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 052957/0699 →