IP Library › Assignment 037141/0033
Patent Assignment
Reel/Frame 037141/0033

Assignment of Assignor's Interest

Recorded: 2015-11-25 Pages: 5
Assignors
EDELSTEIN, DANIEL C.
Executed: 2015-11-16
YANG, CHIH-CHAO
Executed: 2015-11-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Advanced Copper Interconnects with Hybrid Microstructure
Patent: 9,799,605 →
Application: 14/952,017 →
Publication: US 2017/0148738
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name Sep 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061388/0199 →
Change of Name Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →