IP Library › Assignment 037212/0103
Patent Assignment
Reel/Frame 037212/0103

Assignment of Assignor's Interest

Recorded: 2015-12-04 Pages: 7
Assignors
NISHIKAWA, MASATOSHI
Executed: 2015-12-03
FUNAYAMA, KOTA
Executed: 2015-12-04
MIWA, TORU
Executed: 2015-12-03
OGAWA, HIROYUKI
Executed: 2015-12-03
Assignee
SANDISK TECHNOLOGIES INC.
TWO LEGACY TOWN CENTER, 6900 NORTH DALLAS PARKWAY, PLANO, TEXAS, 75024
Covered Property (1)
Vertical Resistor in 3D Memory Device with Two-Tier Stack
Patent: 9,691,781 →
Application: 14/959,169 →
Publication: US 2017/0162592
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038812/0954 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →