Patent Assignment
Reel/Frame 037241/0021
Assignment of Assignor's Interest
Recorded: 2015-12-08
Pages: 6
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Multi-Die Package Having Different Types of Semiconductor Dies Attached to the Same Thermally Conductive Flange
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 8, 2015
From: KOMPOSCH, ALEXANDER; AGAR, BILL; LEFEVRE, MICHAEL
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 037241/0071 →
Merger and Change of Name
Jul 21, 2016
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.; INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 039203/0814 →
Assignment of Assignor's Interest
Aug 25, 2016
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 039532/0249 →
Assignment of Assignor's Interest
May 22, 2018
From: INFINEON TECHNOLOGIES AG
To: CREE, INC.
Reel/Frame 045870/0504 →
Change of Name
Feb 14, 2022
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 059085/0667 →
Assignment of Assignor's Interest
Dec 29, 2023
From: WOLFSPEED, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 066236/0086 →
Assignment of Assignor's Interest
Aug 5, 2024
From: WOLFSPEED, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 068310/0001 →
Change of Name
Aug 5, 2024
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 068179/0679 →