Assignment of Assignor's Interest

Recorded: 2015-12-30 Pages: 3

Assignors

BANG, WON BAE

Executed: 2015-10-12

KIM, BYONG JIN

Executed: 2015-10-13

KIM, GI JEONG

Executed: 2015-10-13

CHUNG, JI YOUNG

Executed: 2015-10-13

Assignee

AMKOR TECHNOLOGY, INC.

2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284

Covered Property (1)

Electronic Package Structure Having Insulated Substrate with Lands and Conductive Patterns

Patent: 9,922,919 →

Application: 14/984,064 →

Publication: US 2016/0276236

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.