Patent Assignment
Reel/Frame 038258/0426
Assignment of Assignor's Interest
Recorded: 2016-04-12
Pages: 8
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2016-04-12
Assignee
QUORA TECHNOLOGY, INC.
244 BELBLOSSOM DRIVE, LOS GATOS, CALIFORNIA, 95032
Covered Properties
(22)
Solid State Lighting Devices with Selected Thermal Expansion and/or Surface Characteristics, and Associated Methods
PCT:
PCT/US2010/046535 ↗
Gallium Nitride Wafer Substrate for Solid State Lighting Devices, and Associated Systems and Methods
PCT:
PCT/US2010/060761 ↗
Engineered Substrates for Semiconductor Devices and Associated Systems and Methods
PCT:
PCT/US2012/050787 ↗
Engineered Substrates Having Epitaxial Formation Structures with Enhanced Shear Strength and Associates Systems and Methods
PCT:
PCT/US2013/078503 ↗
Engineered Substrate Assemblies with Epitaxial Templates and Relates Systems, Methods, and Devices
PCT:
PCT/US2013/078512 ↗
Solid-State Light Emitters Having Substrates with Thermal and Electrical Conductivity Enhancements and Method of Manufacture
Solid State Lighting Devices with Selected Thermal Expansion and/or Surface Characteristics, and Associated Methods
Gallium Nitride Wafer Substrate for Solid State Lighting Devices, and Associated Systems and Methods
Engineered Substrates for Semiconductor Devices and Associated Systems and Methods
Solid State Lighting Devices with Selected Thermal Expansion and/or Surface Characteristics, and Associated Methods
Engineered Substrate Assemblies with Epitaxial Templates and Related Systems, Methods, and Devices
Engineered Substrates Having Epitaxial Formation Structures with Enhanced Shear Strength and Associated Systems and Methods
Solid State Lighting Devices with Selected Thermal Expansion and/or Surface Characteristics, and Associated Methods
Gallium Nitride Wafer Substrate for Solid State Lighting Devices and Associated Systems
Engineered Substrate Assemblies with Epitaxial Templates and Related Systems, Methods, and Devices
Solid-State Light Emitters Having Substrates with Thermal and Electrical Conductivity Enhancements and Method of Manufacture
Engineered Substrates Having Epitaxial Formation Structures with Enhanced Shear Strength and Associated Systems and Methods
Solid State Lighting Devices with Selected Thermal Expansion and/or Surface Characteristics, and Associated Methods
Engineered Substrates for Semiconductor Devices and Associated Systems and Methods
Silicon / Poly-Aluminum Nitride Substrate
Application:
61/236,300 →
Silicon / Poly-Aluminum Nitride Substrate
Application:
61/261,065 →
Gallium Nitride Wafer Substrate
Application:
61/286,828 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 15, 2010
From: SCHELLHAMMER, SCOTT D.; SILLS, SCOTT E.; KURTH, CASEY
To: MICRON TECHNOLOGY, INC.
Reel/Frame 024691/0471 →
Assignment of Assignor's Interest
Feb 7, 2011
From: PARK, JI-SOO
To: AMBERWAVE SYSTEMS CORPORATION
Reel/Frame 025756/0256 →
Assignment of Assignor's Interest
Feb 7, 2011
From: PARK, JI-SOO
To: AMBERWAVE SYSTEMS CORPORATION
Reel/Frame 025756/0245 →
Assignment of Assignor's Interest
Feb 8, 2011
From: AMBERWAVE SYSTEMS CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025759/0281 →
Assignment of Assignor's Interest
Feb 8, 2011
From: AMBERWAVE SYSTEMS CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025759/0211 →
Assignment of Assignor's Interest
Feb 9, 2011
From: PARK, JI-SOO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025794/0351 →
Assignment of Assignor's Interest
Mar 1, 2011
From: LOCHTEFELD, ANTHONY; MARCHAND, HUGUES
To: AMBERWAVE SYSTEMS CORPORATION
Reel/Frame 025881/0479 →
Assignment of Assignor's Interest
Mar 1, 2011
From: LOCHTEFELD, ANTHONY; MARCHAND, HUGUES
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025880/0967 →
Assignment of Assignor's Interest
Mar 1, 2011
From: AMBERWAVE SYSTEMS CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025881/0581 →
Assignment of Assignor's Interest
Aug 31, 2011
From: SCHUBERT, MARTIN F.; BASCERI, CEM; ODNOBLYUDOV, VLADIMIR; KURTH, CASEY
To: MICRON TECHNOLOGY, INC.
Reel/Frame 026841/0037 →
Assignment of Assignor's Interest
Jan 2, 2013
From: COURSEY, BELFORD T.; GEALY, F. DANIEL; BECK, GEORGE E.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 029556/0925 →
Assignment of Assignor's Interest
Jan 2, 2013
From: ODNOBLYUDOV, VLADIMIR; SCHUBERT, MARTIN F.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 029555/0348 →
Assignment of Assignor's Interest
Feb 5, 2016
From: SCHUBERT, MARTIN F.; BASCERI, CEM; ODNOBLYUDOV, VLADIMIR; KURTH, CASEY
To: MICRON TECHNOLOGY, INC.
Reel/Frame 037676/0297 →
Assignment of Assignor's Interest
Mar 17, 2016
From: COURSEY, BELFORD T.; GEALY, F. DANIEL; BECK, GEORGE E.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 038018/0528 →
Assignment of Assignor's Interest
Oct 5, 2017
From: PARK, JI-SOO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 043800/0089 →
Change of Name
Oct 5, 2017
From: QUORA TECHNOLOGY, INC.
To: QROMIS, INC.
Reel/Frame 044134/0711 →
Change of Name
Nov 9, 2017
From: QUORA TECHNOLOGY, INC.
To: QROMIS, INC.
Reel/Frame 044416/0683 →
Change of Name
Dec 6, 2018
From: QUORA TECHNOLOGY, INC.
To: QROMIS, INC.
Reel/Frame 047735/0663 →