Patent Assignment
Reel/Frame 039110/0300
Assignment of Assignor's Interest
Recorded: 2016-07-08
Pages: 5
Assignors
BRIGGS, BENJAMIN DAVID
Executed: 2016-06-30
CLEVENGER, LAWRENCE A.
Executed: 2016-06-30
DEPROSPO, BARTLET H.
Executed: 2016-06-30
HUANG, HUAI
Executed: 2016-06-30
PENNY, CHRISTOPHER J.
Executed: 2016-06-30
RIZZOLO, MICHAEL
Executed: 2016-06-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Sep 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061388/0199 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0448 →