Patent Assignment
Reel/Frame 040292/0225
Assignment of Assignor's Interest
Recorded: 2016-11-11
Pages: 11
Assignors
GOSWAMI, JAYDEB
Executed: 2016-11-07
BIAN, ZAILONG
Executed: 2016-11-08
HU, YUSHI
Executed: 2016-11-08
BLOMILEY, ERIC R.
Executed: 2016-11-08
GUHA, JAYDIP
Executed: 2016-11-10
GEHRKE, THOMAS
Executed: 2016-11-07
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property
(1)
Conductive Structures, Wordlines and Transistors
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 3 to Patent Security Agreement
Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →