IP Library › Assignment 040450/0391
Patent Assignment
Reel/Frame 040450/0391

Assignment of Assignor's Interest

Recorded: 2016-11-29 Pages: 4
Assignors
KIRBY, KYLE K.
Executed: 2008-10-13
PAREKH, KUNAL R.
Executed: 2008-10-15
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707
Covered Property (1)
Semiconductor Substrates with Unitary Vias and via Terminals, and Associated Systems and Methods
Patent: 9,935,085 →
Application: 15/361,659 →
Publication: US 2017/0077067
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 3 to Patent Security Agreement Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →