IP Library › Assignment 041403/0773
Patent Assignment
Reel/Frame 041403/0773

Assignment of Assignor's Interest

Recorded: 2017-02-28 Pages: 4
Assignors
COSTA, XIYING
Executed: 2017-02-28
MAO, DAXIN
Executed: 2017-02-28
PETTI, CHRISTOPHER
Executed: 2017-02-28
LEE, DANA
Executed: 2017-02-28
LEE, YAO-SHENG
Executed: 2017-02-28
Assignee
SANDISK TECHNOLOGIES LLC
6900 NORTH DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Properties (2)
Three-Dimensional Memory Devices Containing Inter-Tier Dummy Memory Cells and Methods of Making the Same
Application: 15/445,579 →
Publication: US 2018/0182771
Stacked Vertical Memory Array Architectures Connection Through Dummy Cells
Application: 62/437,944 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →