Patent Assignment
Reel/Frame 041846/0283
Assignment of Assignor's Interest
Recorded: 2017-04-04
Pages: 2
Assignors
KAWASHITA, MICHIHIRO
Executed: 2009-12-07
YOSHIMURA, YASUHIRO
Executed: 2009-12-07
TANAKA, NAOTAKA
Executed: 2009-12-15
NAITO, TAKAHIRO
Executed: 2010-01-18
AKAZAWA, TAKASHI
Executed: 2009-12-29
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Name
Apr 4, 2017
From: NEC ELECTRONICS CORPORATION
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 042154/0964 →
Merger
Apr 4, 2017
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 042157/0071 →
Assignment of Assignor's Interest
Apr 4, 2017
From: RENESAS TECHNOLOGY CORP.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 042157/0183 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →