Patent Assignment
Reel/Frame 042157/0183
Assignment of Assignor's Interest
Recorded: 2017-04-04
Pages: 54
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2014-03-18
Assignee
TESSERA ADVANCED TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
Apr 4, 2017
From: KAWASHITA, MICHIHIRO; YOSHIMURA, YASUHIRO; TANAKA, NAOTAKA; NAITO, TAKAHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 041846/0283 →
Change of Name
Apr 4, 2017
From: NEC ELECTRONICS CORPORATION
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 042154/0964 →
Merger
Apr 4, 2017
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 042157/0071 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →