Patent Assignment
Reel/Frame 042154/0964
Change of Name
Recorded: 2017-04-04
Pages: 24
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS TECHNOLOGY CORP.
1753, SHIMONUMABE NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
Apr 4, 2017
From: KAWASHITA, MICHIHIRO; YOSHIMURA, YASUHIRO; TANAKA, NAOTAKA; NAITO, TAKAHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 041846/0283 →
Merger
Apr 4, 2017
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 042157/0071 →
Assignment of Assignor's Interest
Apr 4, 2017
From: RENESAS TECHNOLOGY CORP.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 042157/0183 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →