IP Library › Assignment 043639/0339
Patent Assignment
Reel/Frame 043639/0339

Assignment of Assignor's Interest

Recorded: 2017-09-20 Pages: 5
Assignors
HEMBREE, DAVID R.
Executed: 2016-10-31
STEPHENSON, WILLIAM R.
Executed: 2016-11-01
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Stacked Semiconductor Die Assemblies with High Efficiency Thermal Paths and Molded Underfill
Application: 15/298,156 →
Publication: US 2018/0108592
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 3 to Patent Security Agreement Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →