IP Library › Assignment 044994/0701
Patent Assignment
Reel/Frame 044994/0701

Assignment of Assignor's Interest

Recorded: 2018-02-21 Pages: 3
Assignor
WATANABE, MITSUHISA
Executed: 2015-12-25
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Stacked Semiconductor Dies with Selective Capillary Under Fill
Application: 15/901,799 →
Publication: US 2018/0182738
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 8 to Patent Security Agreement May 7, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 046084/0955 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0965 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →