IP Library › Assignment 045136/0669
Patent Assignment
Reel/Frame 045136/0669

Assignment of Assignor's Interest

Recorded: 2018-03-07 Pages: 11
Assignors
ZHU, HONGBIN
Executed: 2017-04-18
HALLER, GORDON
Executed: 2017-12-20
SUN, JIE
Executed: 2017-05-09
KOVAL, RANDY J
Executed: 2018-03-07
HOPKINS, JOHN
Executed: 2017-08-16
Assignee
MICRON TECHNOLOGY, INC.
8000 SO. FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Semiconductor Devices and Methods of Fabrication
Application: 15/296,858 →
Publication: US 2018/0108669
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 2 to Patent Security Agreement Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041671/0902 →
Employment Agreement in Lieu of Assignment Mar 2, 2018
From: LU, ZHENYU
To: MICRON TECHNOLOGY, INC.
Reel/Frame 045484/0480 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050680/0268 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →