IP Library › Assignment 045484/0480
Patent Assignment
Reel/Frame 045484/0480

Employment Agreement in Lieu of Assignment

Recorded: 2018-03-02 Pages: 3
Assignor
LU, ZHENYU
Executed: 2004-08-09
Assignee
MICRON TECHNOLOGY, INC.
8000 SO. FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Semiconductor Devices and Methods of Fabrication
Application: 15/296,858 →
Publication: US 2018/0108669
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 2 to Patent Security Agreement Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041671/0902 →
Assignment of Assignor's Interest Mar 7, 2018
From: ZHU, HONGBIN; HALLER, GORDON; SUN, JIE; KOVAL, RANDY J
To: MICRON TECHNOLOGY, INC.
Reel/Frame 045136/0669 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050680/0268 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →