Patent Assignment
Reel/Frame 045243/0862
Assignment of Assignor's Interest
Recorded: 2018-02-03
Pages: 3
Assignors
BANG, WON BAE
Executed: 2015-10-12
KIM, BYONG JIN
Executed: 2015-10-13
KIM, GI JEONG
Executed: 2015-10-13
CHUNG, JI YOUNG
Executed: 2015-10-13
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method of Forming a Molded Substrate Electronic Package and Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Sep 25, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 053887/0575 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →