Patent Assignment
Reel/Frame 053887/0575
Assignment of Assignor's Interest
Recorded: 2020-09-25
Pages: 43
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-01-01
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12-03, 248373, SINGAPORE
Covered Property
(1)
Method of Forming a Molded Substrate Electronic Package and Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 3, 2018
From: BANG, WON BAE; KIM, BYONG JIN; KIM, GI JEONG; CHUNG, JI YOUNG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 045243/0862 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →