Patent Assignment
Reel/Frame 045373/0879
Assignment of Assignor's Interest
Recorded: 2018-03-28
Pages: 7
Assignors
BITZ, BRADLEY R.
Executed: 2016-06-02
LI, XIAO
Executed: 2016-06-02
GANDHI, JASPREET S.
Executed: 2016-06-14
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Method for Manufacturing a Semiconductor Device Assembly with Through-Mold Cooling Channel Formed in Encapsulant
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 8 to Patent Security Agreement
May 7, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 046084/0955 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0965 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →