Patent Assignment
Reel/Frame 046394/0651
Change of Name
Recorded: 2018-06-20
Pages: 3
Assignor
NEOPAD TECHNOLOGIES CORPORATION
Executed: 2008-07-09
Assignee
NEXPLANAR CORPORATION
7425 NW EVERGREEN PARKWAY, SUITE 150, HILLSBORO, OREGON, 97124
Covered Property
(1)
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Application:
14/562,589 →
Publication:
US 2015/0093977
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Intellectual Property Security Joinder Agreement
Dec 31, 2015
From: NEXPLANAR CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037407/0071 →
Assignment of Assignor's Interest
Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Assignment of Assignor's Interest
Jun 20, 2018
From: DEOPURA, MANISH
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 046139/0956 →
Assignment of Assignor's Interest
Jun 20, 2018
From: VAIDYA, HEM M.; ROY, PRADIP K.
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 046139/0824 →
Release of Security Interest
Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →