Patent Assignment
Reel/Frame 046864/0001
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2018-08-21
Received: 2018-08-21
Pages: 272
Assignor
LONGITUDE SEMICONDUCTOR S.A.R.L.
Executed: 2018-07-31
Assignee
LONGITUDE LICENSING LIMITED
BRACKEN ROAD, SANDYFORD, FIRST FLOOR, BLACKTHORN EXCHANGE, DUBLIN, IEX, D18 P3Y9, IRELAND
Covered Applications
(41)
SET SCREW GAP CONTROL BETWEEN FIXED AND VARIABLE VANES
App. No. 16/130,042
→
Memory Module and Memory System
App. No. 15/996,974
→
Semiconductor Device and Method for Manufacturing the Same
App. No. 15/990,792
→
MEMORY SYSTEM AND DATA TRANSMISSION METHOD
App. No. 15/937,518
→
SEMICONDUCTOR DEVICE VERIFYING SIGNAL SUPPLIED FROM OUTSIDE
App. No. 15/903,666
→
SEMICONDUCTOR DEVICE CHIP SELECTION
App. No. 15/896,830
→
SEMICONDUCTOR MEMORY DEVICE, METHOD OF CONTROLLING READ PREAMBLE SIGNAL THEREOF, AND DATA TRANSMISSION SYSTEM
App. No. 15/896,665
→
Semiconductor Device
App. No. 15/890,553
→
SYSTEM, METHOD, AND CONTROLLER FOR SUPPLYING ADDRESS AND COMMAND SIGNALS AFTER A CHIP SELECT SIGNAL
App. No. 15/875,574
→
SEMICONDUCTOR DEVICE
App. No. 15/870,453
→
BATTERY CRADLE AND BATTERY CRADLE ASSEMBLY
App. No. 15/804,705
→
SEMICONDUCTOR DEVICE HAVING PDA FUNCTION
App. No. 15/624,511
→
DYNAMIC SENSOR SELECTION FOR SELF-DRIVING VEHICLES
App. No. 15/467,525
→
SEMICONDUCTOR DEVICE, ADJUSTMENT METHOD THEREOF AND DATA PROCESSING SYSTEM
App. No. 15/425,402
→
SEMICONDUCTOR DEVICE HAVING IMPEDANCE CALIBRATION FUNCTION TO DATA OUTPUT BUFFER AND SEMICONDUCTOR MODULE HAVING THE SAME
App. No. 15/402,909
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SEMICONDUCTOR DEVICE HAVING THROUGH SILICON VIAS AND MANUFACTURING METHOD THEREOF
App. No. 15/332,216
→
DOCUMENT DIFFERENCES ANALYSIS AND PRESENTATION
App. No. 15/280,442
→
SEMICONDUCTOR DEVICE HAVING INTERNAL VOLTAGE GENERATING CIRCUIT
App. No. 15/230,902
→
Connection System for Detachably Connecting Components and Kit With Such
App. No. 15/078,376
→
Electrical Connector Assembly Having Connector Bodies And Removable Caps
App. No. 14/987,342
→
SEMICONDUCTOR CHIP STACK WITH IDENTIFICATION SECTION ON CHIP SIDE-SURFACES FOR STACKING ALIGNMENT
App. No. 14/900,067
→
SEMICONDUCTOR DEVICE HAVING A REDUCED PITCH BETWEEN LEAD-OUT WIRINGS
App. No. 14/781,378
→
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
App. No. 14/781,149
→
SEMICONDUCTOR DEVICE
App. No. 14/779,961
→
SEMICONDUCTOR DEVICE HAVING MULTIPLE SEMICONDUCTOR CHIPS LAMINATED TOGETHER AND ELECTRICALLY CONNECTED
App. No. 14/776,863
→
SOLDER LAYER OF A SEMICONDUCTOR CHIP ARRANGED WITHIN RECESSES
App. No. 14/775,112
→
TESTING CIRCUITS IN STACKED WAFERS USING A CONNECTED ELECTRODE IN THE FIRST WAFER
App. No. 14/820,325
→
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
App. No. 14/762,595
→
FORMING TRANSISTOR GATE STRUCTURES IN A SEMICONDUCTOR USING A MASK LAYER OVER AN INSULATING LAYER
App. No. 14/791,185
→
SEMICONDUCTOR DEVICE HAVING WIRES CONNECTING CONNECTION PADS
App. No. 14/428,207
→
ELECTRICAL CONNECTOR
App. No. 29/499,191
→
SEMICONDUCTOR STORAGE DEVICE
App. No. 14/152,259
→
Radio Frequency Transmitter Adaptors, Methods and Articles of Manufacture
App. No. 13/309,219
→
METHOD AND APPARATUS FOR WING MOUNTING FOR A MODEL AIRPLANE
App. No. 12/620,081
→
MODEL VEHICLE TRANSMISSION SYSTEM
App. No. 11/137,734
→
SYSTEM AND METHOD FOR CONVERTING RADIO CONTROL TRANSMITTER AND JOYSTICK CONTROLLER SIGNALS INTO UNIVERSAL SERIAL BUS SIGNALS
App. No. 10/990,850
→
METHOD FOR ATTACHING AN EMPENNAGE ASSEMBLY TO A MODEL AIRPLANE
App. No. 10/895,164
→
WING-ATTACHMENT MECHANISM FOR A MODEL AIRPLANE
App. No. 10/841,126
→
EMPENNAGE ASSEMBLY AND ATTACHMENT MECHANISM FOR A MODEL AIRPLANE
App. No. 10/690,065
→
MODEL LANDING GEAR ASSEMBLY
App. No. 10/690,062
→
SYSTEM AND METHOD FOR CONVERTING RADIO CONTROL TRANSMITTER AND JOYSTICK CONTROLLER SIGNALS INTO UNIVERSAL SERIAL BUS SIGNALS
App. No. 10/354,484
→