Patent Assignment
Reel/Frame 048754/0238
Assignment of Assignor's Interest
Recorded: 2019-04-01
Pages: 6
Assignors
YU, JIXIN
Executed: 2019-03-27
TOYAMA, FUMIAKI
Executed: 2019-03-27
HIGASHITANI, MASAAKI
Executed: 2019-03-27
ZHANG, TONG
Executed: 2019-03-27
GE, CHUN
Executed: 2019-03-27
LI, XIN YUAN
Executed: 2019-03-28
ALSMEIER, JOHANN
Executed: 2019-03-27
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Memory Die Having Wafer Warpage Reduction Through Stress Balancing Employing Rotated Three-Dimensional Memory Arrays and Method of Making the Same
Patent:
10,658,381 →
Application:
16/367,455 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →