IP Library › Assignment 052239/0594
Patent Assignment
Reel/Frame 052239/0594

Assignment of Assignor's Interest

Recorded: 2020-03-26 Pages: 3
Assignors
INOUE, SATOSHI
Executed: 2017-09-15
ARIZONO, DAISUKE
Executed: 2017-09-15
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property (1)
Semiconductor Memory Device Having Bonded First and Second Semiconductor Chips Provided with Respective Impedance Calibration Control Circuits
Application: 16/831,568 →
Publication: US 2020/0227117
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Oct 14, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 057813/0648 →
Change of Name Dec 2, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058575/0051 →
Change of Name Jan 14, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058737/0415 →