Patent Assignment
Reel/Frame 057813/0648
Merger
Recorded: 2021-10-14
Pages: 3
Assignor
TOSHIBA MEMORY CORPORATION
Executed: 2018-08-01
Assignee
K.K. PANGEA
1-1, MARUNOUCHI 1-CHOME, PALACE BUILDING, 5TH FLOOR, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Memory Device Having Bonded First and Second Semiconductor Chips Provided with Respective Impedance Calibration Control Circuits
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 26, 2020
From: INOUE, SATOSHI; ARIZONO, DAISUKE
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 052239/0594 →
Change of Name
Dec 2, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058575/0051 →
Change of Name
Jan 14, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058737/0415 →