Patent Assignment
Reel/Frame 058575/0051
Change of Name
Recorded: 2021-12-02
Pages: 7
Assignor
K.K. PANGEA
Executed: 2018-08-01
Assignee
TOSHIBA MEMORY CORPORATION
1-1, MARUNOUCHI 1-CHOME, 5TH FLOOR, PALACE BUILDING, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Memory Device Having Bonded First and Second Semiconductor Chips Provided with Respective Impedance Calibration Control Circuits
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 26, 2020
From: INOUE, SATOSHI; ARIZONO, DAISUKE
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 052239/0594 →
Merger
Oct 14, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 057813/0648 →
Change of Name
Jan 14, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058737/0415 →