Patent Assignment
Reel/Frame 053690/0542
Assignment of Assignor's Interest
Recorded: 2020-09-03
Pages: 6
Assignors
EDELSTEIN, DANIEL C.
Executed: 2014-08-21
NGUYEN, SON V.
Executed: 2014-08-20
NOGAMI, TAKESHI
Executed: 2014-08-20
PRIYADARSHINI, DEEPIKA
Executed: 2014-08-20
SHOBHA, HOSADURGA K.
Executed: 2014-08-20
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Copper Interconnect Structure with Manganese Barrier Layer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 053690/0615 →
Certificate of Conversion & Change of Name
Sep 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061388/0199 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →