IP Library Assignment 053690/0615
Patent Assignment
Reel/Frame 053690/0615

Assignment of Assignor's Interest

Recorded: 2020-09-03 Pages: 15
Assignor
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Copper Interconnect Structure with Manganese Barrier Layer
Application: 17/011,823 →
Publication: US US20200402848A1
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2020
From: EDELSTEIN, DANIEL C.; NGUYEN, SON V.; NOGAMI, TAKESHI; PRIYADARSHINI, DEEPIKA
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 053690/0542 →
Certificate of Conversion & Change of Name Sep 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061388/0199 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →