Patent Assignment
Reel/Frame 054269/0366
Assignment of Assignor's Interest
Recorded: 2020-11-04
Pages: 14
Assignor
I3 ELECTRONICS, INC.
Executed: 2019-06-12
Assignee
TTM TECHNOLOGIES NORTH AMERICA, LLC
200 EAST SANDPOINTE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
Pinned Electronic Package with Strengthened Conductive Pad
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 14, 2016
From: I3 ELECTRONICS, INC.
To: M&T BANK
Reel/Frame 040608/0626 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →