IP Library › Assignment 055781/0632
Patent Assignment
Reel/Frame 055781/0632

Assignment of Assignor's Interest

Recorded: 2021-03-31 Pages: 5
Assignors
HUANG, CHUN-CHIEH
Executed: 2021-02-25
LIU, CHIN-MING
Executed: 2021-02-26
Assignees
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
DISTRICT B, ROOM 403,BLOCK B,,RONGCHAO BINHAI BUILDING,NO. 2021,HAIXIU ROAD,, SHENZHEN, CHINA
Covered Property (1)
Method for Manufacturing a Packaged Circuit Structure
Application: 17/218,556 →
Publication: US 2022/0240385
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 062848/0280 →
Assignment of Assignor's Interest Jan 22, 2024
From: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 066191/0808 →