Patent Assignment
Reel/Frame 062848/0280
Assignment of Assignor's Interest
Recorded: 2023-03-01
Pages: 5
Assignors
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Executed: 2023-02-23
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Executed: 2023-02-23
Assignees
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
SL11, NO.8, LANGDONG ROAD, YANCHUAN COMMUNITY,,YANLUO STREET, BAO 'AN DISTRICT, SHENZHEN CITY, SHENZHEN, CHINA
Covered Property
(1)
Method for Manufacturing a Packaged Circuit Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 31, 2021
From: HUANG, CHUN-CHIEH; LIU, CHIN-MING
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 055781/0632 →
Assignment of Assignor's Interest
Jan 22, 2024
From: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 066191/0808 →