IP Library › Assignment 066191/0808
Patent Assignment
Reel/Frame 066191/0808

Assignment of Assignor's Interest

Recorded: 2024-01-22 Pages: 5
Assignors
Assignees
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
SL11, NO.8, LANGDONG ROAD, YANCHUAN COMMUNITY,,YANLUO STREET, BAO 'AN DISTRICT, SHENZHEN CITY, SHENZHEN, CHINA
Covered Property (1)
Method for Manufacturing a Packaged Circuit Structure
Application: 17/218,556 →
Publication: US 2022/0240385
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2021
From: HUANG, CHUN-CHIEH; LIU, CHIN-MING
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 055781/0632 →
Assignment of Assignor's Interest Mar 1, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 062848/0280 →