Patent Assignment
Reel/Frame 056204/0376
Assignment of Assignor's Interest
Recorded: 2021-05-11
Pages: 3
Assignors
SHAO, SHIQIAN
Executed: 2021-05-07
TOYAMA, FUMIAKI
Executed: 2021-05-09
RABKIN, PETER
Executed: 2021-05-10
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Capacitor Structure Including Bonding Pads as Electrodes and Methods of Forming the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →