IP Library › Assignment 056250/0993
Patent Assignment
Reel/Frame 056250/0993

Assignment of Assignor's Interest

Recorded: 2021-05-14 Pages: 7
Assignors
KIM, DO HYUNG
Executed: 2021-04-26
PARK, JUNG SOO
Executed: 2021-04-29
HAN, SEUNG CHUL
Executed: 2021-05-10
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties (3)
Semiconductor Package Using a Coreless Signal Distribution Structure
Patent: 9,780,074 →
Application: 15/018,668 →
Publication: US 2016/0233196
Semiconductor Package Using A Coreless Signal Distribution Structure
Application: 15/689,714 →
Publication: US 2017/0358560
Semiconductor Package Using A Coreless Signal Distribution Structure
Application: 17/156,788 →
Publication: US 2021/0217732
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest Mar 17, 2022
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 059298/0981 →